Shanghai Young Soul Electronics Technology Co.,Ltd.

YD-8608U HIGH-SPEED EUTECTIC DIE BONDER

Application: 6inch, 8inch.
Features: Machine has multiple indendent welding heads which improves efficiency and has full-automatic closed-loop force control; Machine has auto height calibration and double framework detection function; New vision position offset function which is superior to the traditional die bonder in terms of comprehensive function, UPH and accuracy.
Accracy:±25μm.
UPH>35K/H.